Electronics Forum: supplier evaluation (Page 10 of 17)

Re: Stencil Printer for Lead Free Solder

Electronics Forum | Tue Sep 26 09:42:38 EDT 2000 | Chris May

I have to agree with Wolfgang & Jacko. Two months ago, I decide to run a lead free paste trial. The paste was supplied by company "X", and they stayed on site to witness evaluation. I trialled the paste using EXACTLY THE SAME equipment, stencil and

Question on Solder Paste

Electronics Forum | Mon Aug 26 20:35:08 EDT 2002 | davef

There are no industry standards for eutectic solder-paste in conjunction with the life span of solder-paste. Whatever that is. Speaking of that ['whatever that is.'], what do you mean by �life span of solder-paste�? Is that: * Shelf life? * Workin

Component Lead Finish - Article in Japanese Can some body help ?

Electronics Forum | Wed Nov 20 18:41:57 EST 2002 | slthomas

Here's part of what I could read: "We evaluated the influence of Lift-off (Fillet-lifting) and the influence of thermal fatigue, in this case on combination between various terminal platings of electronic components and Pb-free solder, Sn-37Pb solde

Wave soldering profiling

Electronics Forum | Tue Jun 10 10:58:54 EDT 2003 | Frank

Hi, I currently work on SMT department to uptimize all process. I've just selected the solder paste after testing 15 different products. To be able to do that, I had to create a procedure to evaluate each paste and to be sure that my profil was per

Through hole reliablility lead free

Electronics Forum | Tue Oct 17 03:13:10 EDT 2006 | charless

Apoligies Steve if I did not explain myself clearly. We have made the same design using the same RoHs compliant components (which I am assured by the suppliers are process temperature capable) with both lead and lead free solder. Without wishing to

BGA failure at Functional Test

Electronics Forum | Mon Jan 12 02:29:13 EST 2009 | sachu_70

Hi Milan, One cause for such BGA failures could either be a laminate warp (bow or twist) formed during your Reflow or Wave soldering process, or perhaps a warp seen on the BGA component package itself prior to processing on SMT line. IPC guidelines f

DIMA smro 0406 is good machine or not for doing lead free reflow

Electronics Forum | Tue Dec 23 10:31:46 EST 2014 | jimpat

Sounds like your volumes are pretty low. Pick and Place is the bottleneck in the assembly line. Consider an oven that can keep up with the throughput of your P&P. "The best" is determined on individual cases for a specific application and enviro

Re: Reflow Oven Evaluation Using Cpk

Electronics Forum | Sat Mar 21 12:10:03 EST 1998 | Philip C. Kazmierowicz

| Cpk's on top flight ovens (e.g., Conceptronics, Heller, Electrovert, Vitronics) vary wildly, from 1 to 2+, between different supplers. The suppliers don't seem to understand Cpk's. A supplier's rep whose oven has a Cpk of 1.0 told me: | 1. Cpk's

Re: Reflow Oven Evaluation Using Cpk

Electronics Forum | Sat Mar 21 16:33:09 EST 1998 | Earl Moon

| | | Cpk's on top flight ovens (e.g., Conceptronics, Heller, Electrovert, Vitronics) vary wildly, from 1 to 2+, between different supplers. The suppliers don't seem to understand Cpk's. A supplier's rep whose oven has a Cpk of 1.0 told me: | | 1.

Re: Popcorn @ reflow

Electronics Forum | Thu May 20 03:34:56 EDT 1999 | Earl Moon

| hello...can somebody help me regarding the POPCORN at Reflow. What is this POPCORN at reflow, what it looks like, its cause and corrective action if there is... | | your help is greatly appreciated...thanks | | omat marasigan | | Omat baby, Mo


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